Bluetooth LE v5.0 module – Tokyo Components Japan

Tokyo Component Co., Ltd. plans to start sample shipment of BLE modules compatible with Bluetooth LE v5.0 from May 2019.

1) Chipset: AB1611
2) Size: 11mmx16mmx2.5mm
3) Bluetooth
・ Bluetooth Ver5.0 Specification Compliant
・ 2Mbps, Long Range, ADV extension, SIG Mesh
・ TX Power: 9.5dBm, 0dBm (PWR Option) Select)
・ RX Sensitivity: -94dBm @ 1Mbps
4) Platform
・ Integrate Andes N8 32bit 72MHz MCU
・ Integrate 512KB flash and 54KB RAM
・ GPIO: 21
・ AIO: 9
・ PWM x4, SPI, UART, I2S, I2C

It is expected to be sold in various fields such as home appliances, beauty equipment, health equipment, LED lighting, industrial equipment, smart cities, smart industry, and smart agriculture.

For detailed specifications, samples, and quotations, please contact us from “Inquiries” .

In October 2003, we acquired Sony Corporation’s “Green Partner” certification. We would like to continue to actively contribute to society by actively tackling environmental problems and taking action in consideration

Tokyo Component Co., Ltd. acquired ISO14001 certification in April 2005. We will continue to improve our environmental management system. Registration date: April 28, 2005 Tokyo Component Co., Ltd.

Tokyo Component Co., Ltd. acquired ISO9001 certification in March 2008. We will continue to improve our quality management system. Registration date: March 25, 2008

Tokyo Component Co., Ltd. will start selling Pixleplus image sensors from July 2017 . Image sensors are being increasingly adopted in various fields such as surveillance cameras and security fields,

Please feel free to contact us first.